WAFER PROCESSING SYSTEM AND WAFER PROCESSING METHOD USING SAME

摘要

A wafer processing system and a wafer processing method are disclosed. A semiconductor manufacturer is provided with a wafer comprising a wafer ID assigned by a wafer manufacturer. Next, the wafer ID is mapped as a wafer unique identification code of the semiconductor manufacturer, and then the wafer ID is identified as the wafer unique identification code without the need to form a separate laser mark.