POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE

摘要

The invention provides a polyimide resin having a glass transition temperature in a range from 200 to 320°C and containing a siloxane type diamine residual group, a fluorene type diamine residual group, and specified tetracarboxylic acid dianhydride residual groups at specified ratios. The invention also provides an innovative polyimide resin composition having high solubility in an organic solvent and excellent heat resistance. Further, the invention provides a laminate film with excellent adhesiveness and soldering heat resistance and a metal layer-bearing laminate film and a semiconductor device with high reliability by using the metal layer-bearing laminate film.