CHIP PACKAGE AND FABRICATION METHOD THEREOF

摘要

A chip package includes a substrate, a capacitive sensing layer and a computing chip. The substrate has a first surface and a second surface opposite to the first surface, and the capacitive sensing layer is disposed above the second surface and having a third surface opposite to the second surface, which the capacitive sensing layer includes a plurality of capacitive sensing electrodes and a plurality of metal wires. The capacitive sensing electrodes are on the second surface, and the metal wires are on the capacitive sensing electrodes. The computing chip is disposed above the third surface and electrically connected to the capacitive sensing electrodes.

主权项

1. A chip package, comprising:
a substrate having a first surface and a second surface opposite to the first surface; a capacitive sensing layer disposed above the second surface and having a third surface opposite to the second surface, the capacitive sensing layer comprising:
a plurality of capacitive sensing electrodes disposed on the second surface, anda plurality of metal wires disposed on the capacitive sensing electrodes; and a computing chip disposed above the third surface and electrically connected to the capacitive sensing electrodes.