| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for efficiently forming a thin gold plating layer pattern devoid of defects on a stainless steel substrate by inhibiting the corrosion of the stainless steel substrate and a stainless steel substrate having a gold plating pattern.SOLUTION: At a first plating step, a desired site of a pretreated stainless steel substrate 11 is immersed within a hydrochloric acid-based plating solution 100 for forming a first gold plating layer 12 on the site thus immersed, whereas a second gold plating layer 13 of a desired pattern is formed atop the first gold plating layer 12 via mask plating at a second plating step; at this second plating step, the second gold plating layer 13 is formed continuously from atop the first gold plating layer 12 to a desired position atop the stainless steel substrate 11 within at least a portion of the fringe portion 12a of the first gold plating layer 12 corresponding to the position of the liquid surface 100a of the hydrochloric acid-based plating solution 100 at the first plating step. |
