发明名称 |
OBERFLÄCHENBEHANDELTE KUPFERFOLIE UND IHRE HERSTELLUNG UND KUPFERKASCHIERTES LAMINAT DARAUS |
摘要 |
An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in peel strength against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in zinc-plated or zinc-alloy-plated anti-corrosive copper foil. Another object is to impart excellent moisture resistance, heat resistance, and long-term storage stability to the surface-treated copper foil. In order to attain these objects, the invention provides a surface-treated copper foil for producing printed wiring boards which has been subjected to nodular treatment and anti-corrosion treatment of a surface of a copper foil, wherein the anti-corrosion treatment includes forming a zinc or zinc alloy plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the zinc or zinc alloy plating layer; forming a chromic-ion-containing silane coupling agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C. |
申请公布号 |
DE60131338(T2) |
申请公布日期 |
2008.09.11 |
申请号 |
DE2001631338T |
申请日期 |
2001.01.24 |
申请人 |
MITSUI MINING & SMELTING CO. LTD. |
发明人 |
MITSUHASHI, MASAKAZU;KATAOKA, TAKASHI;TAKAHASHI, NAOTOMI |
分类号 |
H05K1/09;H05K3/38;B32B15/08;C23C28/00;C25D1/04;C25D3/38;C25D3/56;C25D5/16;C25D5/48;C25D7/00;C25D7/06 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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