| 发明名称 |
Heat dissipating high power systems |
| 摘要 |
An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components. |
| 申请公布号 |
US9408308(B2) |
申请公布日期 |
2016.08.02 |
| 申请号 |
US201514589351 |
申请日期 |
2015.01.05 |
| 申请人 |
Marvell Israel (M.I.S.L) Ltd. |
发明人 |
Elkaslassy Daniel;Kalmanoviz Daniel |
| 分类号 |
H05K1/18;H05K7/20;H05K1/11;H05K3/30;H05K1/02 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board (PCB) comprising:
first electronic components are mounted on a first side of the PCB, the first electronic components have a power consumption that is greater than a power consumption threshold for the first electronic components and greater than power consumptions of second electronic components mounted on a second side of the PCB and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB; and the second electronic components are mounted on the second side of the PCB, and at least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components, the second electronic components being passive non-integrated circuit (IC) components. |
| 地址 |
Yokneam IL |
