| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation component which has higher heat dissipation effect on a heat generating component and increases appropriation to other heat generating components even when the heat dissipation component is specially shaped or arranged, for example, asymmetrical about the heat generating component because of structural restrictions. SOLUTION: The heat dissipation component 1 has a fitting structure disposed in contact with a surface of an electronic component so as to dissipate heat generated by the electronic component (heat generating component 2), and the fitting structure can have a position of fitting to the electronic component moved. The fitting structure has a plurality of fitting holes 3 bored in the heat dissipation component 1, and the electronic component is fixed to one of the plurality of fitting hole 3 with a screw 5 or by caulking etc. COPYRIGHT: (C)2009,JPO&INPIT
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