发明名称 CHIP RESISTOR SUBSTRAT
摘要 <p>A method for the targeted introduction of cleavage lines or predetermined breaking lines in ceramic substrates for subsequent separation, wherein, in a thermal treatment step or methods step, the cleavage line or predetermined breaking line is heated locally and then cooled suddenly by a coolant in such a way that targeted cracking or material weakness occurs along the cleavage line or predetermined breaking lines.</p>
申请公布号 EP2151149(A1) 申请公布日期 2010.02.10
申请号 EP20080736308 申请日期 2008.04.17
申请人 CERAMTEC AG 发明人 KLUGE, CLAUS PETER
分类号 H05K3/00;B28D1/22;C03B33/09;H01C17/00;H05K1/03;H05K1/16 主分类号 H05K3/00
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