Integrated device with defined heat flow

摘要

An integrated device includes at least one heat generating component which generates heat when operated, at least one temperature-sensitive component, and one or more hollow insulation regions arranged between the at least one heat generating component and the at least one temperature-sensitive component. The hollow insulation region may be provided as a vacuum gap.

主权项

1. A method for fabricating an integrated device, comprising the steps of:
providing a heat removing element; providing a substrate layer on the heat removing element, the substrate layer having one or more components, including a heat generating component; forming a plurality of through-vias extending entirely through the substrate layer; and forming, while applying a low-pressure atmosphere or a vacuum environment on the substrate layer, a hollow insulation region, by hermetically closing at least one of the through-vias, wherein the hollow insulation region is a first vacuum gap, and wherein the hollow insulation region partly encompasses the heat generating component and defines a heat flow channel in the substrate layer for channeling heat from the heat generating component to the heat removing element.