| 摘要 |
PROBLEM TO BE SOLVED: To prevent excessive load on a solder and carry out soldering in good condition in a process of soldering an electronic component to a circuit board. SOLUTION: Soldering lands for mounting a BGA package includes normal lands 1 and special lands 2 which are formed on a substrate main body 20. The substrate main body 20 has a concave portion 5. The normal lands 1 consist of conductive members 3 formed at predetermined portions on a mounting surface P of the substrate main body 20 except for the concave portion 5, while the special lands 2 consist of conductive members 3 formed on the bottom of the concave portion 5. COPYRIGHT: (C)2008,JPO&INPIT
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