Microphone Module and Method of Manufacturing Thereof

摘要

A microphone module includes a package including a semiconductor chip and having a recess on an upper surface and a micro-electro-mechanical microphone being electrically connected to the package. Further, the micro-electro-mechanical microphone is arranged on the upper surface of the package. The recess forms an acoustic back volume of the micro-electro-mechanical microphone.

主权项

1. A microphone module, comprising:
a package body having a recess on an upper surface; a semiconductor chip embedded in the package body; and a micro-electro-mechanical microphone chip comprising an electro-mechanical element arranged over the recess and electrically connected to the semiconductor chip, wherein the package body and the micro-electro-mechanical microphone chip have an equal lateral dimension in at least one lateral direction.