| 摘要 |
The invention relates to a method for applying metallizations to ceramic substrates (1), wherein the metallizations consist of pads (2) and signal conductor tracks (3), and the pads (2) have a greater thickness than the signal conductor tracks (3), and metallizations are printed on in at least one method step using the screen printing method which is known per se. So that pads (2) having a large thickness and signal conductor tracks (3) having a small thickness can be applied to a ceramic substrate (1) in a cost-effective manner, the following method steps to be carried out in sequence are proposed: a) using a ceramic substrate (1) made of aluminium nitride (AlN), b) printing on the pads (2) with the screen printing method using a screen with one or more printing operations, c) introducing the signal conductor tracks (3) using a laser, wherein the laser beam is directed to the ceramic substrate (1) along the signal conductor tracks (3) to be created and, as a result of the heat of the laser beam at the location at which the laser beam impinges on the substrate (1), the aluminium nitride of the substrate (1) is converted into the electrically conductive aluminium, d) at the same time as or after method step (c), directing the laser beam to the connecting region (4) between the pads (2) and the signal conductor tracks (3) in order to create an electrically conductive connecting region (4) which connects the signal conductor tracks (3) to the pads (4) in an electrically conductive manner, and e) optionally electrically applying a metal coating to the pads (2) and to the signal conductor tracks (3). |
