POLYAMIDE MOULDING COMPOUNDS FOR LARGE MOULDED PARTS

摘要

The invention concerns polyamide moulding compound, in particular for producing heat-resistant moulded parts, having the following composition: (A) 20 to 79 wt. % of at least one partially aromatic polyamide in the form of a copolyamide which comprises 50 to 80 mol. % units formed by hexanediamine and terephthalic acid; (B) 1 to 15 wt. % of at least one impact-resistant modifier; (C) 20 to 60 wt. % of at least one carbon fibre; and (D) 0 to 5 wt. % of at least one additive, components (A) to (D) adding up to 100 wt. %.