| 摘要 |
The present invention discloses an analyzing method and a severing apparatus which effectively severs laminated boards.The solutions are as follows. On the first face (11a) of a first substrate (11) is provided with a first grading groove (11c) at the two end parts (11d) around the outer circumference (11e) of the first substrate (11). On the first face (12a) of a second substrate (12) is provided with a second grading groove (12c) at the two end parts (12d) around the outer circumference (12e) of the first substrate (12).When the first grading groove (11c) and the second grading groove (12d) come into being. The first face of the first substrate adheres to a substrate (10) and is pressed tight together before being severed by the second grading groove (12c). The second face of the second substrate adheres to a substrate (10) and is pressed tight together before being severed by the second grading groove (11c). |
