| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode bulb which becomes advantageous for improvement of light-emitting efficiency and usable service life of the light-emitting diode bulb since air convection in the surroundings of a heat dissipation bump becomes smooth, and the total heat dissipation efficiency is improved by designing the heat dissipation bump for heat dissipation in a form different in height. <P>SOLUTION: The light-emitting diode bulb includes: a circuit board having opposing first and second surfaces; a plurality of light-emitting diodes installed on the first surface; and a heat dissipation structure which includes a heat dissipation plate to have opposing third and fourth surfaces in which the third surface of the heat dissipation plate is bonded to the second surface of the circuit board, and in which, on the fourth surface, a plurality of heat dissipation bumps are installed, of which a length gradually becomes shorter from the center of the fourth surface toward a peripheral edge. <P>COPYRIGHT: (C)2012,JPO&INPIT |
