| 摘要 |
A polishing pad ( 104, 304, 404, 504 ) having an annular polishing track ( 152, 312, 412, 512 ) for polishing a wafer ( 120, 316, 416, 516 ). A plurality of grooves ( 112, 320, 420, 520 ) are arranged within the wafer track so that they are spaced from one another both radially and circumferentially relative to the rotational nature of pad and are at least partially non-circumferential relative to the pad.
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