发明名称 THERMALLY CONTROLLED SELF-ASSEMBLY METHOD AND SUPPORT
摘要 A support (60) and a method for assembling micro-components (80, 84) to binding sites (62, 64, 66, 68) on the support are provided. The support has a pattern of electrical conductors adapted to conduct electrical energy between binding sites. In accordance with the method, an electrical signal is passed through at least one conductive path including at least one of the conductors so that heat is generated by a portion of each conductive path proximate to the binding sites, a first fluid (72) is applied to the support that is adapted to increase in viscosity when heated, and, a carrier fluid (73) having first micro-components (80) adapted to engage the binding sites is applied to the support. Wherein the heat from the at least one conductive path increases the viscosity of the first fluid in areas (92, 94) proximate to the selected binding sites (62, 66) so as to inhibit first micro-components from engaging the binding sites (62, 66) .
申请公布号 WO2006028942(A3) 申请公布日期 2006.06.15
申请号 WO2005US31239 申请日期 2005.09.01
申请人 EASTMAN KODAK COMPANY;RICKS, THEODORE K.;SHARMA, RAVI 发明人 RICKS, THEODORE K.;SHARMA, RAVI
分类号 H01L21/98;H01L23/34 主分类号 H01L21/98
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