| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic-wiring-board dividing device that surely divides ceramic wiring boards into product units while preventing the occurrence of a remaining coupled-state between metallization layers. SOLUTION: An auxiliary dividing mechanism 35 imparts a dividing force in a mode different from that of a main dividing mechanism 150 to a workpiece substrate W2 in transfer. The auxiliary dividing mechanism is provided on the downstream side of the main dividing mechanism 150 in order to eliminate the remaining coupled-state via the metallization part 1P, between the product units 1 that are adjacent to each other after being divided along dividing grooves 31A, 31B while passing through the main dividing mechanism 150. COPYRIGHT: (C)2008,JPO&INPIT
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