| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a semiconductor package, such as a tape carrier package, by reducing a test pad region without changing the direction of a semiconductor chip. SOLUTION: The arrangement region of a test pad used for inspection can be optimized by arranging an input test pad 20a at a pattern region adjacent to the space area of the arrangement region (group 21) of an output test pad 10, thus miniaturizing the semiconductor package. COPYRIGHT: (C)2006,JPO&NCIPI |
