CIRCUIT BOARD COMPRISING SPATIAL LIGHT MODULATOR

摘要

An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is positioned within the cavity and is electrically connected to the redistribution layer. The electronic component further comprises a Peltier heater/cooler device, comprising a first heater/cooler surface, at least one pair of thermoelectric members and a second heater/cooler surface. The first heater/cooler surface, the thermoelectric members and the second heater/cooler surface are coplanar and are at least partially embedded between layers of the circuit board. The Peltier heater/cooler device is in thermal contact with the spatial light modulator device.