SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that enables high density transmission with a good yield at low cost, and to provide a semiconductor device obtained by the method.SOLUTION: A method of manufacturing a semiconductor device 101 includes the following steps of: (I) mounting a plurality of first semiconductor elements 2 on a carrier; (II) encapsulating the first semiconductor elements 2 with an insulation material 3 as a block to form an encapsulation body 3; (III) peeling the carrier to expose electrodes 7 of the first semiconductor elements 2; and (IV) mounting second semiconductor elements 4 by flip-chip connection astride two or more first semiconductor elements 2.SELECTED DRAWING: Figure 5