| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity to both of light of 350-370 nm and light of 400-410 nm, capable of forming a resist pattern having a good profile with high resolution, and ensuring good strippability of the formed resist pattern, and a photosensitive element using the composition. <P>SOLUTION: The photosensitive resin composition contains (A) a binder, (B) a photopolymerizable compound having an ethylenically unsaturated bond, (C) a photopolymerization initiator and (D) a sensitizing dye, wherein the photosensitive resin composition contains as the component (B) a photopolymerizable compound having one polymerizable ethylenically unsaturated bond and a photopolymerizable compound having two or more polymerizable ethylenically unsaturated bonds, and when the photosensitive resin composition is formed into a predetermined photosensitive resin composition layer, the photosensitive resin composition layer has an absorbance to light of 365 nm and an absorbance to light of 405 nm each in a range of 0.1-0.9. <P>COPYRIGHT: (C)2007,JPO&INPIT |
