| 摘要 |
A chip on flex (COF) unit (10), comprising: a flexible dielectric layer (11); a plurality of pins being located on the flexible dielectric layer (11) and used to input signals; and a first drive circuit module (12.1) and a second drive circuit module (12.2), the first drive circuit module (12.1) being connected to at least a portion of the pins for inputting signals, and cascading wiring (15) being provided between the first drive circuit module (12.1) and the second drive circuit module (12.2) to establish cascading signal therebetween. The number of the signal channels in each of the drive circuit modules (12.1, 12.2) can be a half of the signal channels required by the whole COF unit (10), such that the signal channels can be distributed over a plurality of drive circuit modules(12.1, 12.2), thus greatly improving heat dissipation efficiency. |
