A sensor arrangement (100) comprises a sensor chip (200). The sensor chip (200) comprises a sensor (300) sensitive to a variable to be measured. The sensor (300) provides a sensor signal (x). The sensor chip (200) further comprises a stress sensor (400) sensitive to stress in the sensor chip (200). The stress sensor (400) provides a stress signal (y). A compensator (500) of the sensor arrangement (100) is configured to determine a stress compensated sensor signal (z) dependent on the sensor signal (x) and the stress signal (y).
