LIGHT EMITTING DEVICE

摘要

A light emitting device in which a bonding pad is soldered to a mounting substrate, wherein the bonding pad may be formed in various shapes that can minimize the occurrence of voids during soldering or heat fusion.

主权项

1. A light emitting device, comprising:
a first bonding pad configured to be soldered to a mounting substrate; a first electrode electrically connected to the first bonding pad via a first connection electrode; a first conductive type semiconductor layer connected to the first electrode; and a solder ball contactable region and a non-conductive region, wherein: the first bonding pad comprises at least two elongate, opposed regions disposed in the solder ball contactable region; and the non-conductive region is disposed between the at least two elongate, opposed regions.