发明名称 METHOD AND DEVICE FOR USE IN THERMAL COUPLED ANALYSIS
摘要 PROBLEM TO BE SOLVED: To provide a method, etc., for executing a thermal CFD analysis on a structure having first and second parts and a deformable third part located between these parts and in contact with each of them.SOLUTION: The thermal CFD model of a structure is generated using 3D-CAD software, with a volume of a structure including a third part, a boundary part with the third part in a first part, and a boundary part with the third part in a second part replaced with a fictitious fourth part having a uniform thickness twice or more a mesh size used in applying a mesh pattern to the first and second parts. The shape of the third part deformed upon receiving a load is derived from the structure analysis of the structure analysis model of the structure, and the value of the coefficient of thermal conductivity of the fourth part is calculated next on the basis of the known values of the thicknesses of the third and fourth parts, the shape of the deformed third part, the boundary part in the first and second parts, and the known value of the coefficient of thermal conductivity of the third part. The thermal CFD analysis of the thermal CFD model is executed using the calculated coefficient of thermal conductivity of the fourth part.SELECTED DRAWING: Figure 3
申请公布号 JP2016212841(A) 申请公布日期 2016.12.15
申请号 JP20160075236 申请日期 2016.04.04
申请人 FUJITSU LTD 发明人 KUBOTA TETSUYUKI;PETER CHOW;SERBAN GEORGESCU;FUJISAKI AKIHIKO
分类号 G06F17/50;G01N25/18 主分类号 G06F17/50
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