| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a conductor pattern by which the conductor pattern with wiring having a rectangular cross-sectional shape can be formed even when a resist pattern has a sufficient curing rate, releasability, etc., and the conductor pattern has narrow line widths at the time of manufacturing a resist pattern, conductor pattern, and printed wiring board by using a direct resist plotting method, in the method of manufacturing the printed wiring board and producing resist ink which can be used suitably for the method. SOLUTION: (1) After the resist pattern is formed by using the direct resist plotting method, metal patterns are formed at portions where the resist pattern is not formed by a plating method, and the conductor pattern is formed by peeling and removing the resist pattern. (2) Then the conductor pattern described in (1) is formed by using photosensitive resist ink. (3) In addition, the printed wiring board is manufactured by using the method described in (1) or (2). (4) Finally, the resist ink used for the methods described in (1)-(3) is produced. COPYRIGHT: (C)2005,JPO&NCIPI
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