| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum suction device capable of grinding a wafer into a very flat surface. SOLUTION: The device is provided with a placing section 11 consisting of a ceramic/glass porous composite having a placing surface 11a for vacuum-sucking a workpiece W to be sucked; a peripheral edge portion 12 consisting of a circular ceramic/glass porous composite surrounding the outer circumference of the placing portion; and a supporting section 13 provided with air inlet ports 14 communicating to air pores of the placing section and supporting the placing section and the peripheral edge portion. The vacuum suction device vacuum-sucks the workpiece to be sucked on substantially the same plane of the placing surface 11a and the peripheral edge surface 12a to grind the workpiece. The peripheral edge portion 12 has a structure in which air closing pores are substantially uniformly distributed. COPYRIGHT: (C)2008,JPO&INPIT |
