| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing liquid capable of enhancing polishing speed of a film to be polished and enhancing surface flatness after polishing in a CMP technology for flattening the film to be polished such as an interlayer insulation film, a BPSG film and an STI film.SOLUTION: There is provided a polishing liquid containing a polymer compound B having cerium oxide particle, propionic acid, a carboxylic acid group or a carboxylate group and water, and having pKa of propionic acid of less than 9, the content of propionic acid of 0.001 to 1 mass% based on the total mass of the polishing liquid, the content of the polymer compound B of 0.01 to 0.50 mass% based on the total mass of the polishing liquid and pH of 4.0 to 7.0.SELECTED DRAWING: None |
