发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.
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申请公布号 |
US8222720(B2) |
申请公布日期 |
2012.07.17 |
申请号 |
US20100953499 |
申请日期 |
2010.11.24 |
申请人 |
SHIMANUKI YOSHIHIKO;SUZUKI YOSHIHIRO;TSUCHIYA KOJI;RENESAS ELECTRONICS CORPORATION |
发明人 |
SHIMANUKI YOSHIHIKO;SUZUKI YOSHIHIRO;TSUCHIYA KOJI |
分类号 |
H01L23/495;H01L21/56;H01L23/31 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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