发明名称 LASER BEAM CUTTING-OFF APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam cutting-off apparatus which is configured to be compact while securing a wide space for cleaning work. <P>SOLUTION: The laser beam cutting-off apparatus 1 includes a machining head 2 arranged above a workpiece W, such as a metal plate, a machining base 4 arranged below the workpiece W, and radiates a laser beam L from the machining head 2 having a condenser lens 11 via a nozzle 13 for jetting assist gas, and further includes an elevating means 31 for elevating the machining base 4 in the vertical direction, and a traversing means 36 for moving the machining base 4 in the horizontal direction. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008307556(A) 申请公布日期 2008.12.25
申请号 JP20070155870 申请日期 2007.06.13
申请人 NIPPON SHARYO SEIZO KAISHA LTD 发明人 MITSUTA TADAHIRO
分类号 B23K26/38;B23K26/08;B23K26/14;B23K26/42 主分类号 B23K26/38
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