| 摘要 |
Thermoelectric devices are provided. In one embodiment, a thermoelectric device may include a glass wafer defined by conductive vias, a second wafer, and a plurality of metal film disposed between the glass wafer and the second wafer, and also against solid, conductive, integral, end surfaces of the conductive vias. Methods of forming the devices, along with methods of using the devices to transform heat energy to electricity are also provided. |
