| 摘要 |
A method and system are provided for determining mechanical stress experienced by a film during fabrication thereof on a substrate positioned in a vacuum deposition chamber. The substrate' s first surface is disposed to have the film deposited thereon and the substrate's opposing second surface is a specular reflective surface. A portion of the substrate is supported. An optical displacement sensor is positioned in the vacuum deposition chamber in a spaced-apart relationship with respect to a portion of the substrate's second surface. During film deposition on the substrate' s first surface, displacement of the portion of the substrate' s second surface is measured using the optical displacement sensor. The measured displacement is indicative of a radius of curvature of the substrate, and the radius of curvature is indicative of mechanical stress being experienced by the film. |
