| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module board with a heat sink having high joint reliability that can reduce not only initial warp after joint to the heat sink, but also warp of a ceramic board under a use environment.SOLUTION: A power module board 10A with a heat sink is configured so that a circuit layer 12 is joined to one surface of a ceramic substrate 11, and the heat sink is joined to the other surface of the ceramic substrate 11 via a heat radiating layer 13. A housing concave portion 31 in which at least a part of the heat radiation layer 13 is housed is formed on a top plate portion 30A of the heat sink, a concave groove portion 33A is formed along the peripheral edge portion 13a of the surface of the heat radiation layer 13 is formed on the bottom surface of the housing concave portion 31, the peripheral edge portion 13a of the surface of the heat radiation layer 13 is provided so as to protrude halfway in the direction of the width W of the concave groove portion 33A, and the inner portion excluding the peripheral edge portion 13a is joined to the surface of a pedestal portion 34A surrounded by the recessed groove portion 33A of the bottom surface of the housing recess portion 31.SELECTED DRAWING: Figure 1 |
