| 摘要 |
A method is provided for processing a workpiece using laser radiation, particularly for the purpose of laser ablation. At least one laser beam is provided, which is affected using at least one changeable beam forming device. The laser beam subsequently impinges upon at least one processing area of the workpiece. Using the beam forming device, at least one specified adjustable beam profile is impressed upon the laser beam at the location of the processing areaconfigured. |
