发明名称 SEMICONDUCTOR CHIP TEST DEVICE AND TEST METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor chip test device and test device that can improve yields of semiconductor chips in contrast to conventional devices and methods.SOLUTION: A test device 101 testing an electric characteristic of a semiconductor chip 50 having an electrode pattern formed on each of front and rear surfaces comprises: a front surface side probe 1 and a rear surface side probe 2 that come into contact with each electrode pattern of the front and rear surfaces, and support the semiconductor chip 50 only by the front surface side probe and rear surface side probe upon testing of an electric characteristic; and an energization device 3 that energizes the semiconductor chip 50 via the front surface side probe 1 and rear surface side probe 2.SELECTED DRAWING: Figure 1
申请公布号 JP2016211977(A) 申请公布日期 2016.12.15
申请号 JP20150096250 申请日期 2015.05.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 UEDA TOSHIYUKI;SAKAI TADAYUKI;SUGAI SHIYUNTA
分类号 G01R31/28;H01L21/66 主分类号 G01R31/28
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