| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket of which the contact can contact by metal to a land on the IC package side, and which can cope with multiple pins, fine pitch, large current, and high speed with high productivity. SOLUTION: One end part of contact piece 14 is formed by resin integrally at a through hole forming part 12 of a socket base body 10, and the portion other than the one end part of the contact piece 14 faces a through hole 21. A plating layer 20 is formed on the inner wall of the through hole 13 penetrating the through hole forming part 12 in front and rear direction, the surface and the rear face of the through hole forming part 12, and over the surface of the contact piece 14, to form a three-dimensional circuit. COPYRIGHT: (C)2008,JPO&INPIT
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