发明名称 |
COMPOSITION FOR CONJUGATE, CONJUGATE STRUCTURE AND MANUFACTURING METHOD OF CONJUGATE STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a composition for conjugation and a conjugation structure capable of enhancing conjugation reliability of first and second conjugation target members after conjugation and controlling interval between the first and second conjugation target members with high accuracy.SOLUTION: A composition for conjugation is used for conjugating a first conjugation target member 2 and a second conjugation target members 3 and 4 by a sintered article of metal atom-containing particles. The composition for conjugation contains a conjugation material containing a metal atom-containing particle and a conductive particle 21 having CV value of a particle diameter of 10% or less. The conductive particle 21 has base material particles and a conductive layer arranged on a surface of the base material particles.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016195126(A) |
申请公布日期 |
2016.11.17 |
申请号 |
JP20160131603 |
申请日期 |
2016.07.01 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
UENOYAMA SHINYA |
分类号 |
H01B1/22;B22F1/00;B22F7/08;B23K35/34;H01B1/00 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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