发明名称 |
Microelectronic substrate retainer apparatus providing reduced microelectronic substrate damage |
摘要 |
An apparatus for attenuating physical damage to a substrate, along with an attendant method, comprises as a first component a base plate having defined therein a location for receiving a substrate cassette. The apparatus also comprises a substrate retainer movably attached to the base plate such that when the substrate cassette having a substrate contained therein is positioned on the base plate at the location for receiving the substrate cassette, and the substrate is subjected to a mechanical force, the substrate retainer moves such as to retain the substrate within the substrate cassette with a retaining force. Both the apparatus and the method are particularly applicable for attenuating damage to a substrate when spin-drying the substrate.
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申请公布号 |
US2002092195(A1) |
申请公布日期 |
2002.07.18 |
申请号 |
US20010761299 |
申请日期 |
2001.01.16 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., |
发明人 |
CHEN HUNG-WEN;YEN DAVID |
分类号 |
H01L21/00;H01L21/673;H01L21/687;(IPC1-7):F26B17/24;F26B17/30 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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