发明名称 Microelectronic substrate retainer apparatus providing reduced microelectronic substrate damage
摘要 An apparatus for attenuating physical damage to a substrate, along with an attendant method, comprises as a first component a base plate having defined therein a location for receiving a substrate cassette. The apparatus also comprises a substrate retainer movably attached to the base plate such that when the substrate cassette having a substrate contained therein is positioned on the base plate at the location for receiving the substrate cassette, and the substrate is subjected to a mechanical force, the substrate retainer moves such as to retain the substrate within the substrate cassette with a retaining force. Both the apparatus and the method are particularly applicable for attenuating damage to a substrate when spin-drying the substrate.
申请公布号 US2002092195(A1) 申请公布日期 2002.07.18
申请号 US20010761299 申请日期 2001.01.16
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., 发明人 CHEN HUNG-WEN;YEN DAVID
分类号 H01L21/00;H01L21/673;H01L21/687;(IPC1-7):F26B17/24;F26B17/30 主分类号 H01L21/00
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