发明名称 SEALED BALL GRID ARRAY PACKAGE
摘要 According to an aspect of the invention, there is provided an electrical package device comprising: a first substrate (2) and a second substrate (3) enclosing a first electric component (4), a second electric component (7) supported by said second substrate; a plurality of connectors (5) for mechanically connecting said first and second substrates in a stacked arrangement; and a seal (6) provided between said first and second substrates at a distance from said first electric component; wherein said first electric component is electrically connected to said second electric component by connecting circuitry comprising said connectors; and wherein said connectors are provided in said seal. Preferably, said seal comprises a no flow resin material.
申请公布号 EP2122681(A1) 申请公布日期 2009.11.25
申请号 EP20080712597 申请日期 2008.02.08
申请人 NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO 发明人 VENINGA, ERIK, PETER
分类号 H01L23/498;H01L23/055;H01L23/66;H01L25/065;H05K1/14 主分类号 H01L23/498
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