发明名称 LASER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser processing device capable of efficiently applying proper laser processing along a division expected line set in a workpiece.SOLUTION: Laser beam irradiation means 5 comprises: laser beam oscillation means for oscillating a laser beam of the wavelength having transmissivity to a workpiece; and a condenser for condensing the laser beam oscillated from the laser beam oscillation means and applying the laser beam to the workpiece held by workpiece holding means. The condenser comprises: a condenser lens 532 for condensing the laser beam oscillated from the laser beam oscillation means; and a spherical aberration expansion lens 533 for expanding a spherical aberration of the condenser lens. A shield tunnel composed of a pore and amorphous for shielding the pore, is formed toward a lower surface from an upper surface of the workpiece by applying a pulse laser beam to the workpiece held by the workpiece holding means from the condenser.SELECTED DRAWING: Figure 2
申请公布号 JP2016198788(A) 申请公布日期 2016.12.01
申请号 JP20150079711 申请日期 2015.04.09
申请人 DISCO ABRASIVE SYST LTD 发明人 MORIKAZU YOJI;TAKEDA NOBORU;HIRATA KAZUYA
分类号 B23K26/55;B23K26/00;H01L21/301;H01S3/00 主分类号 B23K26/55
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