发明名称 |
Thin film device supply body, method of fabricating thin film device, method of transfer, method of fabricating semiconductor device, and electronic equipment |
摘要 |
A technique is described in which a layer to be transferred is easily peeled and transferred to a transferred body that is pliable or flexible. Also, a method of fabricating a semiconductor device using these peeling and transfer techniques, and electronic equipment fabricated with the semiconductor device is described. A transfer method in which a layer to be transferred formed on a substrate is transferred to a transfer body that is pliable or flexible includes the first step of forming a layer to be transferred on a substrate; the second step of bonding the layer to be transferred formed on the substrate to a transfer body that is pliable or flexible fixed on a fixture; and the third step of peeling the layer to be transferred from the substrate and transferring the layer to be transferred to the transfer body.
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申请公布号 |
US2007287242(A1) |
申请公布日期 |
2007.12.13 |
申请号 |
US20070878377 |
申请日期 |
2007.07.24 |
申请人 |
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发明人 |
KODAIRA TAIMEI;UTSUNOMIYA SUMIO |
分类号 |
H01L21/336;H01L21/68;H01L21/8234;H01L51/00;H01L51/40 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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