MOULDED CIRCUIT MODULE, AND PRODUCTION METHOD THEREFOR

摘要

The purpose of the present invention is to reduce the reciprocal effect exhibited in cases when electronic components which affect each other as a result of electromagnetic waves are present in one moulded circuit module. This moulded circuit module is provided with a substrate (100) having a plurality of electronic components (200) mounted thereto. One electronic component (200A) is a high-frequency oscillator. A metal partition side wall part (320) is provided to the substrate (100). One surface of the substrate (100) is coated with a first resin (400) such that the electronic components (200) and the side wall part (320) are coated therewith. The electronic component (200A) and the first resin (400) are covered with a shield layer (600) made from an electromagnetic-wave-blocking metal. The electronic component (200A) is surrounded by the side wall part (320) and the shield layer (600).