CARBOXYL GROUP-CONTAINING PHOTOSENSITIVE COMPOUND, PHOTOSENSITIVE RESIN, CURED PRODUCT OF THE SAME, RESIST MATERIAL USING THE SAME, AND PRODUCTION METHOD OF CARBOXYL GROUP-CONTAINING PHOTOSENSITIVE COMPOUND

摘要

PROBLEM TO BE SOLVED: To provide a carboxyl group-containing photosensitive compound that gives a cured product excellent in heat resistance, thermal decomposition resistance and flame retardancy, a photosensitive resin composition, a cured product of the resin, and a resist material using the above compound or resin.SOLUTION: The carboxyl group-containing photosensitive compound is obtained by allowing a polybasic acid anhydride to react with an epoxy acrylate that is obtained by allowing an epoxy compound having a molecular structure represented by formula (1): OG-X-OG to react with a (meth)acrylic acid or a halogenated product of the (meth)acrylic acid. In formula (1), G represents a glycidyl group; and X represents a structural moiety represented by formula (x1) or (x2).SELECTED DRAWING: None