| 发明名称 |
Integrated Circuit Structure and Method of Forming |
| 摘要 |
An integrated circuit structure and method of forming is provided. A die is place on a substrate and encased in molding compound. A redistribution layer is formed overlying the die and the substrate is removed. One or more surface mounted devices and/or packages are connected to the redistribution layer on an opposite side of the redistribution layer from the die. The redistribution layer is connected to a printed circuit board. |
| 申请公布号 |
US2016295700(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201514928768 |
申请日期 |
2015.10.30 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Hung Jui-Pin;Yee Kuo-Chung |
| 分类号 |
H05K1/18;H01L21/683;H01L25/00;H01L21/66;H05K5/00;H05K3/34;H01L25/16;H01L25/065;H01L23/31;H01L23/498;H01L21/56;H05K3/30 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of making a semiconductor device, comprising:
placing a die over a carrier substrate; forming a molding compound adjacent to the die; forming a redistribution layer electrically coupled to the die and overlying the molding compound; removing the carrier substrate; connecting a first substrate to the redistribution layer on an opposite side of the redistribution layer from the die; and connecting the redistribution layer to a printed circuit board. |
| 地址 |
Hsin-Chu TW |
