| 摘要 |
This invention provides a dynamic heat conduction system comprising a base, a resilient unit, a heat conduction block, and at least one securing unit. The base accommodates the resilient unit and the heat conduction block and the at least one securing unit secures at least a portion of the base and the resilient unit within the base. The heat conduction block comprises a heat conduction surface for forming a contact with an electronic device and accomplishes preferably efficient heat conduction by conducting the heat produced by the electronic device through the heat conduction surface, the heat conduction block, and a side surface of the heat conduction block to the base. Still, this invention provides a dynamic heat conduction system comprising a heat conduction board for accommodating a plurality of heat conduction blocks and a plurality of bases for forming a preferable heat conduction path with a plurality of electronic devices having different shapes or sizes. |
