| 发明名称 |
Wire bonding method, surface acoustic wave apparatus and method for producing surface acoustic wave apparatus |
| 摘要 |
A wire bonding method for ultrasonically joining two connecting electrodes with a wire includes the steps of forming at least one of the connecting electrodes with tantalum and forming the wire of one of a metallic wire having a fracture load of about 21 g or greater and a metallic wire having a fracture stress of 290 N/mm2 or greater. |
| 申请公布号 |
GB0105752(D0) |
申请公布日期 |
2001.04.25 |
| 申请号 |
GB20010005752 |
申请日期 |
2001.03.08 |
| 申请人 |
MURATA MANUFACTURING CO LTD |
发明人 |
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| 分类号 |
H01L21/60;B23K20/12;H01L21/607;H03H3/08;H03H9/00;H03H9/145;H03H9/25 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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