发明名称 ACTIVE ENERGY RAY-CURING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition excellent in curing rate and physical properties of cured products by bringing the composition to contain a tetramethylpiperidine-N-oxyl compound derivative in a curable composition containing a polymerizable oligomer and N-vinylformylamide. SOLUTION: This composition is obtained by containing (C) 2,2,6,6- tetramethylpiperidine-N-oxyl compound derivative (e.g. 4-hydroxy-2,2,6,6- tetramethylpiperidine-N-oxyl, etc.), in a composition of (A) a polymerizable oligomer (e.g. a polyurethane acrylate, an unsaturated polyester, etc.), with (B) N-vinylformamide. The ingredient (C) is preferably dissolved homogeneously in 10-10,000 ppm based on the ingredient B. Preferably a reactive diluent (e.g. methyl acrylate, etc.), and a photopolymerization initiator (e.g. benzoin, etc.), except the ingredient B are added to the aforementioned composition.
申请公布号 JP2000319308(A) 申请公布日期 2000.11.21
申请号 JP19990128446 申请日期 1999.05.10
申请人 MITSUBISHI CHEMICALS CORP 发明人 MIKAMI HIROSHI;MORI KOJI;SATO KOICHI;IZUMIKAWA HIROSHI;TANAKA AKIHIKO
分类号 G03F7/004;C08F2/40;C08F2/44;C08F2/50;C08F290/00;C08F290/04;C08F299/04;C09D4/00;C09D7/12;C09D11/033;C09D11/10;C09D11/101;C09D11/103;C09D11/104;C09D11/106;C09J4/00;G03F7/027;G03F7/028 主分类号 G03F7/004
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