| 摘要 |
PROBLEM TO BE SOLVED: To provide a catalyst layer for achieving an electroless plating method without using palladium at low cost with simple process. SOLUTION: The electroless plating method comprises a tin treatment step of bringing a base material into contact with a tin compound aqueous solution containing tin compound, a copper treatment step of bringing the base material 1 in contact with a copper compound aqueous solution containing copper compound after the tin treatment step, a dilute sulfuric acid treatment step of bringing the base material 1 into contact with a dilute sulfuric acid after the copper treatment step, a plating step of depositing a copper plating film 2 by bringing the base material 1 in contact with a copper plating liquid after the dilute sulfuric acid treatment step, and a heat treatment step of heating the base material 1 in an atmosphere substantially containing no oxygen or hydrogen after the plating step. COPYRIGHT: (C)2007,JPO&INPIT
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