| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board for electronic component inspection with a first layered product having a wiring layer having a comparatively high density between ceramic layers, and the second layered product laminated on its back side, wherein the ceramic layer is penetrated by a via-conductor, capable of collecting accurately inspection information of the electronic component to be inspected, and to provide its manufacturing method. SOLUTION: The wiring board for electronic component inspection includes the first layered product comprising ceramic layers, having pads on the surface, the wiring layer between the ceramic layers, and the via-conductors for connecting the pads, the wiring layer, and the backside together; and the second layered product comprising ceramic layers having the same material composition as that of the first layered product, having a plurality of via-conductors penetrating from the surface to the backside, and laminated on the back side of the first layered product. A plurality of lands for connecting a via-conductor exposed to the backside of the first layered product and a via-conductor exposed to the surface of the second layered product, and wiring layers positioned on the periphery thereof are arranged between the first and second layered products, and the diameter of each land is 2-5 times larger than the diameter of each via-conductor. COPYRIGHT: (C)2008,JPO&INPIT |
